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EPOXY RESIN
PAGEL EPOXY - RESIN
Priming
Sealing
Solidification
Adhesion layer
Cover sealing
EH1
low viscosity
high penetration
multi purpose unit
dry surface
EH114
fast setting
reacting from +41 °F
low temperatures
EH115
high bonding on moist
subsoil
moist subsoil
Applications
No
Layer
thickness
(inch)
Components
Application
temperature
(° F)
Application
time
(min)
Consumption
(lbs/ft²)
EH1
1
-
2
50 - 86
45
0.05 - 0.16
EH114
1
-
2
41 - 68
20
0.05 - 0.16
EH115
1
-
2
50 - 86
45
0.05 - 0.16
Data Sheet
MSDS Resin
MSDS Hardener